Abstract: In paralleled silicon carbide (SiC) power semiconductor devices, packaging layout and current sharing have a direct impact on thermal stress distribution and device reliability. This paper ...
Ready-to-use configurations for Anthropic's Claude Code. A comprehensive collection of AI agents, custom commands, settings, hooks, external integrations (MCPs), and project templates to enhance your ...
Imagine trying to design a key for a lock that is constantly changing its shape. That is the exact challenge we face in ...
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