Abstract: This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power module packaging with optimized electrical and thermal performances. The structure of the module is to ...
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Abstract: Silicon carbide (SiC) power module with paralleled multi chips is driven by the demand for compact size and high-power density in some emerging applications, especially electric vehicles.
Ethics and dissemination Ethics approval is not required. Investigators will deidentify individual participant data before it is shared. The results will be submitted to a peer-review journal.
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