3D-stacked designs containing a mix of separate logic and memory die represent a somewhat new application for memory BIST (built-in self-test), compared to the more conventional, single-die embedded ...
Tessent MemoryBIST from Siemens EDA provides a complete solution for at-speed test, diagnosis, repair, debug and characterization of embedded memories. Leveraging a flexible hierarchical architecture, ...
Increased integration with nanometer processes is resulting in some devices that are using hundreds of small memory blocks distributed throughout the design. Memory BIST can be used to apply standard ...
Typically, we see a 4X increase in memory size every 3 years to cater to the needs of new generation devices. Deep submicron devices contain a large number of memories which demands lower area and ...
Achieving functional safety levels mandated by the ISO 26262 standard requires periodic testing of a vehicle’s electronics. This testing can be applied at three distinct time periods, each with its ...
Memory test at-speed isn't easy but can be achieved by balancing test selection, area overhead, and test-time constraints. The semiconductor industry has intensified its focus on yield issues to meet ...
3D-stacked designs containing a mix of separate logic and memory die represent a somewhat new application for memory BIST (built-in self-test), compared to the more conventional, single-die embedded ...
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