Semiconductor Engineering

Testing Devices In Module Packages And Designing Cryogenic Current Sensors For All-Electric Aircraft

A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...
Electronic Design

Detect IGBT Module Defects in Acoustic 3D

A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
PR Newswire

Teardown Analysis of Infineon's IGBT CooliRDie Power Module - Research and Markets

Research and Markets has announced the addition of the "Infineonc: Teardown Analysis" report to their offering. The CooliR²Die innovative power module from Infineon is an IGBT module for automotive ...
Electronic Design

IGBT/SiC Module Drivers Target Traction Inverters for EV, HEV, Fuel-Cell Vehicles

Power Integrations launched a family of ASIL B-qualified, dual-channel, plug-and-play gate-driver boards for both SiC MOSFETs and silicon IGBTs. At PCIM Europe, Power Integrations announced the SCALE ...