Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability.

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" report has been added to ...

Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...

A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...

It shows the response of the device to stimulus in mathematical manner with little or no consideration for the underlying device physics. Semi-physics model describes the semiconductor physics and it ...

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...

(MENAFN- GlobeNewsWire - Nasdaq) The report "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging ...