New York, United States , April 16, 2024 (GLOBE NEWSWIRE) -- The Global RF Front End Module Market Size is to Grow from USD 24.56 Billion in 2023 to USD 83.21 Billion by 2033, at a Compound Annual ...

No audio available for this content. TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new ...

With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...

Within the framework of the BEYOND5 project, CEA-Leti researchers have developed energy-efficient RF power modules based on SOI technology. This innovation won an award at the IEEE RFIC 2025 ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

5G is coming and with Qualcomm's help it will be coming faster and with more features than originally anticipated. It's easy to find a great phone today. In fact, current flagship devices are so good ...