As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

Venice, Florida &@8212 Solido Design Automation has introduced a scalable and extensible solution for meeting design challenges created by process variations at nanometer feature sizes. The new ...

Compare 3 process flows in terms of robustness to process variation to see which one has the lowest likelihood of processing failures. Sub-5 nm logic nodes will require an extremely high level of ...

Decision making is a critical step in semiconductor technology development. R&D semiconductor engineers must consider different design and process options early in the development of a next-generation ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...