The semiconductor ceramic packaging materials market is set to expand from USD 1.85 billion in 2025 to USD 2.78 billion by ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

How fully has AI taken over packaging, power and manufacturing priorities? With more than 92,000 visitors and 1,850 ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...