Semiconductor Engineering

FeFET Multi-Level Cells For In-Memory Computing In 28nm

A technical paper titled “First demonstration of in-memory computing crossbar using multi-level Cell FeFET” was published by researchers at Robert Bosch, University of Stuttgart, Indian Institute of ...
Semiconductor Engineering

Demonstrating A 2D–0D Hybrid Optical Multi-Level Memory Device Operated By Laser Pulses

A technical paper titled “Probing Optical Multi-Level Memory Effects in Single Core–Shell Quantum Dots and Application Through 2D-0D Hybrid Inverters” was published by researchers at Korea Institute ...
Design-Reuse

Advancing In-Memory Computing: A Global Effort to Build More Efficient AI Hardware

Artificial intelligence is driving one of the most significant architectural shifts the semiconductor industry has seen in decades. As AI workloads continue to expand away from the cloud to ...
Electronic Design

UMI Scales the Memory Wall in the Chiplet/Multi-Die Era

What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...