Many designers think of embedded DRAM—that is, DRAM arrays fabricated on logic SOCs (systems on chips)—as a technological artifact: a technique designers a few years ago tried in moderate-performance ...

This new BCD process is fully compatible with standard CMOS processes and uses high density logic devices (1.8V) and high performance analog devices (5V) with industry-leading low flicker noise. This ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

This week AMD has introduced two new range of products to his ever-growing range of embedded processes announcing the launch of the new AMD EPYC Embedded 3000 processor and AMD Ryzen Embedded V1000 ...

At the start of the year, I highlighted key trends in 5 Embedded Software Trends to Watch in 2024, predicting the forces shaping the industry. As the year unfolded, many of these trends indeed drove ...

The M75 dual-channel serial communications module works with the company's line of process control modules. The independent serial channels can operate in synchronous or asynchronous mode in either ...