Designed for newer BGA and other SMT chipsets that operate at higher speeds and power requirements, the company’s latest BGA heatsinks exploit an elliptical fin design that makes them most efficient ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...
Una es temporal y la puede hacer cualquiera y la otra es la profesional. la temporal es aplicar calor sobre el chip de escalado (Hana) para intentar que las bolitas de estaño del componente BGA ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results