5 th-Generation R-Car SoC Offers Future-Proof Multi-Domain Compute Solutions for Centralized E/E Architecture with Chiplet Extensions MUNICH & TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation ...
TOKYO, Japan--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of a virtual development environment that ...
SHANGHAI--(BUSINESS WIRE)--VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS ®) company, today announced its chip design process has obtained ISO 26262 automotive functional ...
New off-the-shelf, cloud-based, digital twin offering, PAVE360 Automotive, empowers automakers and suppliers to begin full-system development on day one, reducing setup time from months to days ...
Developing the electrical/electronic (E/E) systems in automobiles and other vehicles has always been challenging due to the rough environmental conditions experienced on the road and the high ...
The partnership will focus on the development of automotive-grade sensor ICs. Credit: Left: Theo Brunner, Continental Automotive, Head of Electronic Purchasing, Right: Yun Sheng, NOVOSENSE Co-Founder ...
Siemens, a leading industrial technology company, unveiled its PAVE360 Automotive technology, a new category of digital twin software that is pre-integrated and designed as an off-the-shelf offering ...
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